| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC16F872-I/SS | MICROCHIP/微芯 |
SSOP-28 |
18+ |
15999 |
||||
| RPI-579N1 | OHMITE |
DIP-4 |
1802+ |
1064 |
||||
| USB9603-28M | NS/美国国半 |
NS |
1340+ |
73 |
||||
| D05022P-104MLD | COILCRAFT/线艺 |
SMD |
1418+ |
25 |
||||
| JS28F160C3TD70 | INTEL/英特尔 |
TSSOP-48 |
09+ |
5260 |
||||
| DF11-20DP-2DSA01 | HIROSE/广濑 |
SMD |
20+ |
200 |
||||
| 0436501009 | MOLEX/莫仕 |
10P |
18+ |
9815 |
||||
| MTA011-7101 | SHANDENG |
ZIP27 |
20+ |
3891 |
||||
| 10061290-555444PLF | AmphenolFCI |
22+ |
400 |
|||||
| TPS65400RGZR | TI/德州仪器 |
22+ |
12 |
|||||
| MILL-MAX 0677-0-15-01-30-27-10-0 | MILL-MAX |
22+ |
750 |
|||||
| PCIM34W13F400A1 | POSITRONIC |
22+ |
5 |
|||||
| SN74LVC1G126DCKR | TI/德州仪器 |
22+ |
821 |
|||||
| 2341-12-000 | COTO |
DIP-5P |
22+ |
26 |
||||
| LTC6655BHMS8-3#PBF | TI/德州仪器 |
MSOP8 |
22+ |
190 |
||||
| URA4815YMD-30WR3 | MORNSUN金升阳 |
DIP |
22+ |
115 |
||||
| RT0201BRD0714KL | YAGEO/国巨 |
SMD |
22+ |
720000 |
||||
| K4A4G165WF-BCWE | SAMSUNG/三星 |
BGA |
2246+ |
56 |
||||
| MX25L51245GMI-08G | MICRON/美光 |
BGA |
2211+ |
968 |
||||
| LMV7275MGX/NOPB | TI/德州仪器 |
SC70-5 |
19+ |
18953 |
||||
| 10CL010YU256C8G | ADI/亚德诺 |
BGA256 |
23+ |
119 |
||||
| PCR-S50FS+ | 日本本多通信 |
23+ |
174 |
|||||
| SCG-2-242+ | MINI-CIRCUITS |
SMD-6P |
21+ |
7889 |
||||
| DX10-68S(50) | HIROSE/广濑 |
23+ |
100 |
|||||
| PCA82C251T/YM | NXP/恩智浦 |
SOIC-8_150mil |
22+ |
100 |
||||
| 0603CS-36NXGEW | COILCRAFT/线艺 |
0603 |
22+ |
1800 |
||||
| B32796E2406K | EPCOS/爱普科斯 |
DIP |
18+ |
800 |
||||
| R036912L-UH | N/A |
TenPao |
24+ |
5027 |
||||
| FH26W-51S-0.3SHW(60) | FPC连接器 |
HIROSE/广濑 |
SMD |
20+ |
120 |
|||
| UCC3915DP | 热插板控制IC |
TI/德州仪器 |
SOP16 |
1201+ |
52 |